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0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting

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0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting

Brand Name : RUNNING TECH

Model Number : RTM1A8C-001

Place of Origin : CHINA

MOQ : 5pcs

Price : Usd30-50 Per Piece Fob

Payment Terms : T/T, L/C, D/P, Western Union

Supply Ability : 10,000pcs per Month

Delivery Time : 7-20days

Packaging Details : Plastic Inner box + Carton box outer side

Shape : Super Thin Parallel Wheel, Circle

Grinding Material : Diamond Grits

Type : Integral Blade Without Matrix

Out Diameter : 50-120mm

Inner Diameter : 32 or 40mm

Thickness : 0.1-1mm

Grit Size : 120-1500

Processing Object : Semiconductor，Optical Glass, Ceramics, Magnetic Material etc. etc

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Super Hard Tools of Hi Precision Metal Sintered Diamond Dicing Blade

To abrasive or cut Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc

Diamond wheel shape and indicates:

D -- Out Diameter

H -- Inner Diameter

W-- Thickness

0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting

W (mm)

D (mm)

 H (mm)

0.1-1.0

50-120

32, 40, 52, 70

Over 15 years of developing and producing experience in high precision super hard material tools, we have

established a high efficiency system to provide stable performance wheel products.

We welcome yr free inquiry for any question in our diamond cutting wheels. In order to supply exact wheel

type and quotatioon to you, if possible, better for you to provide us more information like followings:

1. Yr processing objects.

2. Yr OD, ID, Thickness data.

3. Grit size if possible.

4. Rotary speed of your processing machine.

Many Thanks.


Product Tags:

0.1mm 50mm Semiconductor Diamond Dicing Blades

      

50mm 0.1mm Diamond Dicing Blades

      

Semiconductor 0.1mm round cutting blades

      
Quality 0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting for sale

0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting Images

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